APCOM 2019
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Applications of Thin Film and Micro Structure for Advanced Manufacturing

Chang-Chun Lee, National Tsing Hua University
Bor-Jiunn Wen, National Taiwan Ocean University


The properties and applications of advanced manufacturing  are determined by the thin film and micro structures. Many important manufacturing issues, such as residual stress/strain, warpage, failure mode, fatigue, reliability, Adhesion, Material properties, and so on,  are of interest and the corresponding mechanisms have not been fully understood. Thus, computational mechanics and related theories, experiments has been widely used to study such complexity in thin films and micro structures in the recent decades. In foregoing topic, we aim to include articles that provide new insight into the theoretical calculation and modeling in thin film and micro structures. The topics include, but are not limited to:
1. Thin film/Micro structure modeling by using finite element model, phase field model, constitutive model, molecular dynamics, ab initio model etc.
2. Thin film/Micro structure evolution, such as domain wall movements, phase transition etc.
3. Thin film/Micro structure engineering and applications, such as strained engineering, domain engineering etc.
4. Fractures and defects, such as voids with stress migration, failure mode etc.
5. Multi-physics and Multi-scale modeling, such as thermo-mechanical, electro-mechanical or magneto-electro-mechanical coupling problems applied to advanced manufacturing  etc.


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  • Home
    • Important Reminder
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  • About
    • About APACM & APCOM
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    • Plenary Speakers ((listed in speech time sequence)
    • Plenary Speakers (listed in alphabetical order)
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